Applied's Sree Kesapragada and Miller Allen, discuss the Endura Cirrus HTX which meets chipmakers’ copper interconnect patterning needs by extending the TiN metal hardmask —the industry’s material of choice — to the 10nm and below nodes.
At the 2014 Flash Memory Summit, I participated in a panel discussion titled, “Is 3D NAND a disruptive technology for Flash storage?” The consensus is that 3D NAND will be the most viable storage technology in the years to come, although opinions were mixed on when that disruption would be evident.
Applied Materials introduces the biggest materials change in interconnect technology in 15 years with the announcement of the new Endura® Volta™ CVD system. Its unique cobalt processes ease critical interconnect scaling bottlenecks to enable continued momentum of Moore’s Law.
The Internet of Things (IoT) is set to drive demand and innovation in the semiconductor market over the next decade. While some consumer IoT applications will require semiconductors manufactured using cutting-edge technologies to deliver fast performance and low power consumption, the vast majority of chips for IoT applications will be utilized in client-side applications. These chips, such as a sensor monitoring room temperature in a connected HVAC system, require processing capabilities that can be met using legacy process (90 and 45nm) technologies manufactured on 200mm wafers.
And herein lies the opportunity and challenge for legacy manufacturing.
At the recent SPIE Advanced Lithography conference, my keynote presentation focused on how improvements in metrology, multi-patterning techniques and materials can enable 3D memory and the critical dimension (CD) scaling of device designs to sub-10nm nodes.
Applied Materials technologists will discuss the latest challenges and innovations in semiconductor manufacturing including mask and wafer patterning, inspection and metrology to help address key scaling issues.
Every year, media outlets publish year-end reviews and outlooks for the New Year. Solid State Technology, a leading magazine providing the latest electronics manufacturing news, analysis and product information related to semiconductor manufacturing features an annual outlook and invited Randhir Thakur, Executive Vice President, General Manager, Silicon Systems Group, Applied Materials to give his assessment of the major trends for 2014. He identified the shifts to 20 nanometer designs, FinFET transistors and 3D NAND as the game-changing innovations and discussed how Applied is focused on providing the precision materials engineering solutions to address the challenges involved in advancing these technologies.