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Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking

by Sesh Ramaswami on 08/31/10
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At this year's SEMICON West 2010, Applied Materials introduced the Producer Avila system, the latest innovation for TSV production. Sesh Ramaswami, Senior Director, Through-Silicon Via Program discusses how Applied Materials is leading the next technology inflection to advance Through-Silicon Via (SV) technology for high-volume manufacturing.Read more

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