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New Memories Take Center Stage

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In the same way that various prophets of doom foretell the imminent demise of Moore’s Law, we often hear that conventional memory technologies are going to run out of steam soon.

However, the semiconductor industry is highly-skilled at extending its existing architectures rather than making the leap to shiny new ones with apparently compelling advantages. Thus, incremental advances in conventional technology have delayed the introduction of a raft of exciting new memory technologies.

When will the tipping point be reached that pushes one or more into the mainstream? Read what the some of the best-informed minds in the business have to say after the jump.

 

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TOTAL RECALL: Advanced Memory Technologies for Higher Performance & Power Efficiency

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Mobile computing is now everywhere, more than ever before as a result of faster and more capable smart phones, tablets, and laptops.

Universal mobility and instant-on connectivity may herald a new era in computing, but improvements in key technologies are necessary if we are going to keep up with consumers’ constant demand for higher performance, longer battery life and ultra-sleek profiles.

To address these technology improvements and answer key questions that may significantly impact the way we interface with an increasingly connected world, Applied Ventures and the MIT Club of Northern California (MITCNC) will host a lively panel discussion with innovators from across the memory value chain on Wednesday, February 1 at 6:30pm in Santa Clara, Calif.Read more

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3D Chip Technology for Dummies

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It's not just movies, televisions and video games that are going three-dimensional these days. Microchips are doing it, too.

Semiconductors aren't shifting into the third dimension because it’s fashionable, though. This shift is about continuing Moore’s Law, the relentless drive for higher performance that has driven the industry for four decades.

With three very different types of 3D construction in development today, it can be a confusing subject. Vertical chip structures, 3D device stacking, 3D chip packaging – what does it all mean?

We made this video to help demystify the subject. Did it help? Let me know in the comments below.

 

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What Does the Future Hold for Memory Technology?

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Every two years, your hard-earned dollar buys twice as much memory capacity. This “law” has held true for decades, and shows no sign of slowing. Sixty years ago, a state-of-the-art memory device was a tube full of mercury, with 500 bits of data stored as acoustic waves travelling up and down between transducers at either end. Today, Flash memory cards containing more than a hundred billion bits can be found at the supermarket, next to the chewing gum.

This relentless progress is the result of the hard work of thousands of researchers and engineers around the globe who are dedicated to advancing memory technology. A few hundred of those technologists (and this humble blogger) met earlier this week at the 2011 IEEE International Memory Workshop in Monterey, California to discuss the future of memory technology.

A highlight of the proceedings was a panel discussion, sponsored by Applied Materials, featuring experts (as pictured below) representing key players in the memory industry – Nokia, Samsung, Toshiba, Hynix and research institution imec.

The panel’s opinions and predictions weren’t always what I was expecting. To learn more, read the article at Solid State Technology Magazine.

 

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Applied Materials CEO Mike Splinter Discusses Q2 FY11 Earnings on CNBC

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Applied Materials chairman and CEO, Mike Splinter, discusses the company's Q2 FY11 earnings results on CNBC's Closing Bell. Visit our web site for a copy of the Q2 FY11 earnings press release.

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